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    Deep-trench 3D printing enables next-gen RF devices with unprecedented precision

    4 days ago

    For decades, traditional lithography techniques—such as electron beam lithography and nanoimprinting—have struggled to meet the demand for ultra-fine, high-aspect-ratio structures in general. Similar difficulty also applies to metal-based radio-frequency (RF) components. Issues like poor thickness control, uneven sidewalls, and material limitations have constrained performance and scalability.
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